Issue link: https://resources.mouser.com/i/1437663
mouser.com/amphenol 5 Amphenol Industrial Operations ENDICOTT, NEW YORK, USA RADSOK® Power to Board The Internet of Things rely on Server and Data Center technologies as its backbone. It's a backbone that necessitates a lot of power in a progressively shrinking printed circuit board (PCB) footprint. Having gone through a rapid expansion in recent years with a higher integration of power-hungry components driving PCB power requirements to new levels. Low-voltage IC packages running at faster speeds are creating the need for delivering more than 100A on high-performance PCBs used in server and data center equipment. Often power cannot be directly terminated to the PCB, thus wire systems must be utilized. To complete the system assembly, one must find wire-terminated connector components that meet power needs and routing feasibility in the often compact spacing of the housing. Amphenol Industrial Operations addresses all of these issues with solutions in its RADSOK Power to Board line. High-speed and high-density electronics have driven demand for significant increases in the amount of power needed for power-to-board applications. To meet the need for higher current-density interconnects Amphenol Industrial Operations developed the RADSOK® Power to Board family of connectors. RADSOK® Power to Board solutions facilitate the distribution of power with higher amperage, while allowing the design engineer to achieve size and weight reductions. Conventional interconnects are limited in their ability to deliver high current without consuming excessive board-surface area. The RADSOK® Power to Board family of connectors incorporates a hyperbolic lamella socket contact construction that provides more contact surface area. The high- performance contact enables higher current-carrying capabilities with lower temperature rises than traditional contact systems. Amphenol's RADSOK® Power to Board product line offers many options for delivering high current and single-point connections to the PCB. This product family is made up of PowerBlok™/PowerBlok™ WTB, RADSERT™, and the PGY™. RADSOK® PowerBlok™ and PowerBlok™ WTB The RADSOK® PowerBlok™'s compact footprint ½" x ½" can supply up to 70A to backplane power connections. Current is distributed over 16 compliant pins. The PowerBlok™ is available for top or bottom entry and offered with a touch-proof cover. • High power-to-board interconnect in a small package • Compact footprint 15.7mm x 15.7mm • RADSOK® 2.4mm, 3.0mm & 3.6mm (35A-60A-70A) • Backplane power interface with compliant pins for power • Touch-Proof Cover • Hyperbolic socket design ensures many points of contact • Reduces failure modes, eliminates burn outs • No threaded fasteners • No special crimp tools required • Eliminates possible stress fractures in board • Faster through-put • Available in Super Twist (ST) • RoHS compliant RADSOK® PowerBlok™ - Key Features