The latest integrated circuits sport faster
processors, denser memories/storage, and a
wealth of features while increasing reliability and
providing lower power usage. Moving to lower
processor nodes and relying on lower operating
voltages enable these enhancements without
dramatically increasing die area, cost, and the
need for specialized processes and materials.
Conversely, power systems using higher voltages
(48V and up) reduce current consumption and
ultimately improve power-transfer efficiency.
In automotive, industrial (robotics), and data
communications systems, this results in a
growing voltage difference between power
systems and applications in the sensor,
processor, storage, and communications fields.
Bridging this voltage divide has typically required
multiple converter stages and trade-offs involving
higher ON Resistance (RON = conduction
losses), which translates to reduced efficiency.
Fortunately, advances in converter technology
and packaging have been developed to
enhance converter efficiency and reduce
conduction losses.
Enhancing Efficiency By Reducing
Converter Stages & R
on
in power
management iCs
This white paper will provide an
overview of trends driving the
need for advanced converter
and packaging technologies
to provide greater efficiency in
high-power (high-voltage and
high-current) solutions.
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