Issue link: https://resources.mouser.com/i/1442808
11 and pressure sensors, are now incorporated in an enormous number of devices. Accelerometers are now a staple feature of mobile devices, allowing the display to "flip" and change with the orientation of the screen. Also, magnetometers supply electronic compass functions, and gyroscopes stabilize movement—in camera lenses, for example. Multi-functional Fusion Sensors Many of these standalone functions find incorporation into multi- functional or "fusion" sensors, and we could see this space- and cost-saving trend accelerate. These fusion centers get employed in both the overall Internet of Things (IoT) and the IIoT. Sensors will be getting help from new industrial protocols, such as IO-Link. These protocols will allow sensors to get smarter, provide more sensing capabilities, and enable internal diagnostics and maintenance information sharing―all while keeping interconnection costs low. The infrastructures installed on the factory floor or in other industrial applications are transitioning from proprietary and serial Fieldbus into newer Ethernet-based networks such as PROFINET or EtherNet/IP to accommodate the higher data volumes required by these new capabilities. The infrastructure itself is migrating from passive media to active control and monitoring to decentralize data management and increase data availability. Technology Convergence While these protocols are vital, it is crucial to keep in mind that the IIoT is a vision made possible by technology convergence. An essential aspect of the convergence process has been the development of a new generation of sensor chips, such as temperature and pressure sensors. A second factor is the arrival of IPv6 addressing, which enables an almost limitless number of people and devices to communicate via the Internet. Third, we have seen the development of several competing protocols for ULP wireless connectivity, which enables sensor-based networks to consume only a small amount of power. Technologies such as the ones described above are developing and increasing in the IIoT and other areas of the IoT, allowing the development of nearly endless new applications and efficiency enhancements. They will be drivers of significant innovation opportunities. However, IIoT deployments are still facing skepticism from traditional mindsets, and there are concerns about security. These issues will have to get addressed before industrial devices and machines on the plant floor are opened to the Internet and allowed to fully benefit from the potential of these new technologies. n OFF-THE-SHELF CABLE ASSEMBLIES • Off-the-shelf solutions with a broad range of connectors in a variety of cable lengths. • Connector ends of these cable assemblies offer premium housing features to prevent mismating, reduce terminal backout, and reduce operator fatigue during assembly. • Meet IPC-specification design and meet current automotive-industry standards. LEARN MORE> ULTRA-FIT POWER CONNECTORS • Eliminate same-circuit-size cross mating and reduce terminal backout occurrences. • The space-saving, low mating force, high-density Ultra-Fit power connector has a 12A or 14A current rating, 3.5mm pitch, and is available with color-coding and mechanical keying options. • Molex Ultra-Fit Power Connectors offer the premium housing features of proven Mini-Fit and Micro-Fit 3.0 connector systems. LEARN MORE> ULTRA-FIT POWER CONNECTORS