Apex 2022 19
SA310 Brushless DC Motor Driver
• Uses Silicon Carbide MOSFET technology
to improve efficiency.
• Three independent half-bridges provide
up to 80A peak output current.
• Drive Brushless DC and Permanent
Magnet Synchronous motors
or DC/AC converters.
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SiC for the Future
As the industry places more and more emphasis on
power electronics, high-reliability design becomes a
paramount concern. Simultaneously, trends toward
higher voltages and currents are challenging the design
of high-reliability systems.
By combining high performance and high reliability
across extreme temperatures and voltages, SiC is
an attractive solution to these challenges. At Apex
Microtechnology, we believe in the power of SiC and
offer highly integrated SiC-based modules to enable the
highest-reliability designs possible for our customers.
Apex Takes on SiC
At Apex Microtechnology, we've adopted SiC in many of
our product offerings to achieve the highest reliability
possible for our customers.
Unlike many other companies with SiC offerings, Apex
is unique in the high level of integration offered in their
products. Apex's SiC offerings all come in modules,
meaning the SiC FETs are included with a gate drive
switch in one package.
By coupling these two circuit blocks in the same product,
Apex provides customers with simplicity of use, avoiding
the need for discrete designs and layouts. Instead,
customers can purchase a single module and design it
directly into their board, guaranteeing high performance
and optimal reliability from the start. This approach not
only ensures optimized performance for customers but
also reduces development costs and design time.
Beyond their ease of use, highly-integrated SiC modules
minimize the device footprint, enabling engineers to
design systems with minimal area and maximum power
density.
Apex's line of SiC-based switching power modules is
already available on the market and includes the SA310,
SA110, and SA111. Looking to the future, Apex continues to
research innovative ways for integrating SiC into power
modules to support more compact, efficient devices.
