Issue link: https://resources.mouser.com/i/1502091
and efficiency. For example, SiC and GaN are emerging as promising alternatives to traditional silicon. These materials offer better power- handling capabilities, faster switching speeds, and higher temperature tolerances, making them ideal for high- power and high-frequency applications. At the same time, these materials allow for smaller power converters to be built (when compared to silicon- based technologies), allowing for reduced weight and PCB sizes. However, these new materials pose new challenges in terms of design and manufacturing. Devices made of SiC and GaN require new packaging techniques and thermal management solutions to ensure reliability and long-term performance. In addition, these new technologies are unable to rely on older passive designs such as traditional resistors and capacitors, and they require new driver designs and passives that can handle the high-frequencies and powers involved. To meet these challenges, Bourns is exploring and evaluating cutting-edge material sciences to develop innovative solutions that can meet the demands of the industry. For example, Bourns is developing new power inductors that can handle high power levels while maintaining a compact size and high efficiency. These inductors use advanced magnetic materials and innovative designs to achieve high inductance and low resistance. Bourns is also developing new thermal management solutions that can handle the high temperatures and power levels of SiC and GaN devices. For example, Bourns new Mini- breaker is a surface mount protection device designed specifically for overtemperature protection. The Mini-breaker has independent conductors and temperature triggers, with bimetal discs calibrated to trip at specific temperatures. The Mini-breaker provides independent overtemperature protection without requiring ancillary components to function. C h a p t e r 5 | H o w p a s s i v e s w i l l s h a p e t h e f u t u r e Going forward, creativity and hard work are key. The engineer must always push to develop creative solutions by using passive components when the easy answer is to use an active component to solve it all." Pyter Ely da Silva Senior Hardware Engineer, Whirlpool Corporation 26 Passives and Their Emerging Applications