15
"Why should LiDAR
designers focus
attention on receiver-end
hardware? That is the
answer for how we can
reduce LiDAR size."
Issa Malke
LiDAR Calibration Engineer,
Velodyne LiDAR, Inc.
packaging and shipping costs. As a result, engineers are faced with designing the smallest
form factor possible while meeting speed, precision, and safety requirements. The smaller
the form factor, the denser the components, which can reduce signal quality, generate more
noise, and generate more heat.
Maxim IOs:
• Significantly reduce the number of peripherals needed in LiDAR systems.
Maxim TIAs:
• Support 128 channels, which packs more channels into one IC and potentially reduces
the part count;
• Deliver the highest bandwidth in the industry, with low noise and low power
consumption, in a small package. The thin dual no-lead (TDFN) package size of 9 mm
2
provides the industry's smallest overall solution size;
• Offer bandwidth options of 160 MHz and 490 MHz (the highest in the industry), which
can amplify pulses of just a few nanoseconds in duration and maintain precision; and
• Through the selectable gain feature, can potentially eliminate the need for another
amplification later by using two pin-selectable transimpedance values of 25 kΩ
and 50 kΩ.
Maxim high-speed comparator units:
• Are available in space-saving packaging as small as 1.2 mm × 0.8 mm (wafer-level
package [WLP]) and operate at −40°C to +125°C.
Chapter One: Solving Key Design Challenges
