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Micron - 5 Experts on Addressing the Hidden Challenges of Embedding Edge AI into End Products

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C h a p t e r 1 | U n l o c k i n g t h e Po w e r : M e m o r y a n d S t o r a g e i n A I A p p l i c a t i o n s Storage capacity is another important factor, as edge devices often need to store large AI models locally and collect and temporarily store data for processing. Insufficient storage can limit the complexity of models that can be deployed or restrict the amount of data that can be processed locally or before transmission to the cloud. Finally, the interface between storage and processing units significantly impacts system performance. High-bandwidth interfaces like Peripheral Component Interconnect Express (PCIe) or Universal Flash Storage (UFS) allow for faster data transfer between storage and AI accelerators or central processing units, reducing bottlenecks in the AI pipeline. The latest UFS 4.0 storage technology clocks in at twice the performance of previous-generation UFS 3.1. Micron is developing memory and storage solutions for edge AI that • Address the unique challenges of embedded systems, including resource limitations, power constraints, and diverse use cases across industries like transportation, factory automation, and video security • Provide high-performance, low-latency options to meet the demanding requirements of AI processing at the edge • Offer a range of technologies—from DRAM and NAND to multi-chip package devices—to handle a broad range of AI applications and performance needs in edge computing environments Mark Harvey Principal FAE, SiMa.ai Memory and storage solutions are pivotal in AI applications because they enable the foundation of deploying and scaling AI, which requires solutions to be ultra low latency, power-efficient, responsible, and secure, which is possible only at the edge." 7 5 Experts on Addressing the Hidden Challenges of Embedding Edge AI into End Products

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