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Micron - 5 Experts on Addressing the Hidden Challenges of Embedding Edge AI into End Products

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To further confound matters, while high-performance memory is desirable for AI applications, cost remains a significant factor, especially in mass-market embedded systems. Designers must carefully weigh the benefits of faster, more expensive memory against budget constraints and the application's specific requirements. In some cases, a hybrid approach may be optimal, using a combination of high-speed memory for mission-critical AI tasks and lower-cost memory for less demanding operations. Such an approach can help optimize the cost- performance ratio of the overall system. Beyond raw performance metrics, edge AI designs must also consider environmental factors. In real- world deployed systems, considerations such as operating environment, longevity, and reliability are central to overall system reliability and performance. For example, these systems may need to function in challenging conditions, including under extreme temperatures, high humidity, or shock and vibration. As a result, memory solutions for edge AI must often be ruggedized and designed for extended operational lifespans. Bringing AI to the edge is so difficult because a bunch of system challenges are behind it. You have to consider the type of AI, where the AI happens, the type of processing and computing required, and the type of memory that goes with it." David Henderson Sr. Director, Industrial & Multi-Market Segment, Micron Technology C h a p t e r 2 | D e s i g n C o n s i d e r a t i o n s f o r E m b e d d e d A I 12 5 Experts on Addressing the Hidden Challenges of Embedding Edge AI into End Products

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