Supplier eBooks

Analog Devices & Molex - 11 Experts on Miniaturized Electronics Design and Applications

Issue link: https://resources.mouser.com/i/1536572

Contents of this Issue

Navigation

Page 13 of 25

C h a p t e r 2 | T h e Tr a d e - O f f s i n Pe r f o r m a n c e , D e s i g n , a n d I n t e g r a t i o n Mechanical robustness becomes harder to achieve as connectors, housings, and interface points shrink. Smaller connectors contain less material, which reduces their ability to withstand mechanical stress or thermal cycling. Engineering solutions here focus on contact geometry, force distribution, and the use of high-strength alloys to restore mechanical resilience without increasing volume. In many cases, engineers must also introduce redundancy, via multipoint contact designs or additional mounting features, to preserve connection reliability. Cost is also an unavoidable element in the discussion of trade-offs. Highly integrated micromodules are more expensive on a per-unit basis than equivalent discrete implementations. However, the value equation often shifts when factoring in the design effort, qualification burden, and procurement complexity that discrete designs entail. For many use cases, the ability to buy a fully qualified signal chain block, Smaller connectors use less metal and material, which can result in a mechanically weaker solution. Reduced contact size also leads to less stable resistance and less reliable connections—challenges we must carefully address." Nobumasa Motohashi Team Manager of Research and Development, Molex 14 11 Experts on Miniaturized Electronics Design and Applications

Articles in this issue

Links on this page

view archives of Supplier eBooks - Analog Devices & Molex - 11 Experts on Miniaturized Electronics Design and Applications