C h a p t e r 2 | T h e Tr a d e - O f f s i n Pe r f o r m a n c e , D e s i g n , a n d I n t e g r a t i o n
Analog Devices helps engineers navigate
the trade-offs of miniaturization by
• Integrating analog front ends, ADCs,
and passive components into
compact micromodules;
• Optimizing headroom and power
delivery architectures to minimize heat
dissipation in high-density systems;
• Using new fabrication processes to
manufacture more power-efficient
active components at the die level;
• Characterizing signal integrity and noise
performance at the module level; and
• Qualifying each subsystem across
electrical, thermal, and mechanical
parameters.
Molex helps engineers navigate the trade-
offs of miniaturization by
• Designing ultra-fine-pitch connectors
that maintain signal integrity despite
increased density and reduced spacing;
• Applying advanced materials, high-
precision contact design, and plating
techniques to reduce contact resistance
and manage thermal rise; and
• Engineering mechanical features
that reinforce structural reliability in
compact interconnects subject to
vibration or repeated mating.
Although integrated modules
have a higher initial engineering
cost than off-the-shelf solutions,
their long-term advantages, such
as a smaller, lighter satellite with
lower power consumption and an
extended mission lifespan, more
than justify the investment."
Gianluca Furano
Sr. On Board Computer Engineer, European Space Agency
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11 Experts on Miniaturized Electronics Design and Applications
