C h a p t e r 1 | T h e Fu n d a m e n t a l s o f M i n i a t u r i z a t i o n
compact modules often stem not from
the silicon itself but from interconnects,
laminates, or thermal mismatches in the
package. Therefore, the qualification
process must account for all of these
layers and verify consistent performance
across temperature, humidity, and
mechanical stress conditions.
Analog Devices enables miniaturized
electronic systems by
• Integrating complete signal chains into
single microchips and micromodules that
co-pack passive and active components;
• Optimizing power efficiency through
advanced low-headroom architectures
in precision analog systems; and
• Delivering pre-characterized, factory-
tested subsystems.
Molex enables miniaturized electronic
systems by
• Engineering high-density connectors
like Quad-Row Connectors with pitches
as small as 0.175mm;
• Leveraging precision stamping,
molding, and plating techniques to
maintain mechanical reliability at
microscales; and
• Developing interconnect solutions
that support high-speed signaling in
compact form factors.
Mounting technology
plays a critical role in the
manufacturability of miniaturized
solutions. For instance, the Quad-
Row connector enables 0.175mm
pitch connections while utilizing
0.35mm mounting technology."
Kenta Sasaki
Senior Manager of Research and Development, Molex
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11 Experts on Miniaturized Electronics Design and Applications
