Issue link: https://resources.mouser.com/i/1540541
C h a p t e r 5 | F u t u r e - P r o o f B u i l d i n g s Power demands follow similar exponential scaling as today's milliwatt sensors evolve into tomorrow's multi- watt edge computing nodes. Current PoE systems deliver up to 90W per port, but AI processing and distributed computing will drive power requirements significantly higher. Infrastructure designed only for today's power levels will require expensive rewiring when advanced systems become mainstream. The Physics of Edge Computing and Intelligent Systems Artificial intelligence and real-time processing requirements reveal why centralized cloud computing cannot support future building automation through latency limitations that physics cannot overcome. Machine learning algorithms processing building sensor data require massive data movement and cloud-based processing introduces network latency that prevents real-time responses to rapidly changing conditions like fire events or security breaches. Local edge computing eliminates these latency constraints but requires infrastructure capable of supporting high-bandwidth connections with ultra- low latency characteristics. The ix Industrial™ connector enables these advanced architectures through 75% size reduction while supporting 10 Gigabit performance, allowing deployment of edge computing systems in space-constrained building locations impossible with traditional connectors. Time-Sensitive Networking (TSN) capabilities become essential when safety-critical applications like fire suppression systems require guaranteed response times that traditional best- effort networking cannot provide. Building Tomorrow's Intelligence Today Understanding standards evolution reveals why early adoption of emerging connectivity standards provides competitive advantages that late adopters cannot achieve. SPE technology represents fundamental infrastructure simplification that supports massive device connectivity with data speeds from 10 Mb/s to 1 Gb/s plus Power over Data Line (PoDL) capability up to 50W over two wires. SPE connector options include IP20 PCB jacks and IP67 sealed circular versions designed for 4A current capacity, providing infrastructure capabilities that compound over time as device populations expand exponentially. Amphenol's comprehensive approach spanning Amphenol Industrial Group connectors (including M8/M12 circular connectors for robotics), Advanced Sensors, and Communications Solutions, eliminates integration risks while providing upgrade paths that leverage existing infrastructure. This integration creates intelligent building ecosystems where connectivity infrastructure decisions determine technological capabilities for decades. Standards development participation influences long-term compatibility more than specification compliance. Amphenol's selection as the Zhaga Book 20 standard connector demonstrates technology leadership, helping create the standards that define future building automation rather than adapting to requirements after they're established. Buildings designed with appropriate connectivity infrastructure today can integrate AI optimization, edge computing, and ubiquitous connectivity as these technologies mature. The convergence of robust power distribution, long- term sensor stability, and future-ready networking creates the foundation for intelligent buildings that adapt and evolve with advancing technologies. 27 Industrial-Grade Building Automation: Rugged, Reliable, Smart