6 Enabling the Industrial IoT Revolution
RADSOK® RADSERT™
RADSERT™'s compact footprint design can deliver up to
120A of current to the board. The high current density
and small surface area connection provides flexibility of
board design. RADSERT™ contacts are available in either
press-fit or solder termination.
RADSOK® RADSERT™ - Key Features
• RADSOK® size 2.4mm or 3.6mm
• 35A-70A rated current and 500V
DC
withstand voltage
• Two point of contact, one positive pole and one
negative pole
• Low profile and impact footprint on PCB
• 6AWG to 8AWG crimp contact with insulated latching
housings
• RADSOK® Socket and Pin: Silver over nickel plating
• Crimp Barrel and Receptacle Body: Tin over nickel
plating
RADSOK® PGY™
AIO's PowerBlok™ WTB power connectors use
patented RADSOK® contact technology to meet the
increasing power requirements of printed circuit
boards and the need for smaller board footprint.
Offered in vertical or horizontal mating planes as
two-point contact terminals, the WTB product
line gives the versatility needed when component
placement decisions are crucial. Supplied in easily
automated tape-and-reel packaging and designed as
pin through-hole placement commonly used in the
industry. Integration is straightforward whether from
design onset or as a component replacement. With
the addition of a removable lock housing, mating to
the board can remain intact under harsh vibration
environments.
RADSOK® PowerBlok™ WTB - Key Features
• RADSOK® size 2.4mm or 3.6mm
• 35A-70A rated current and 500V
DC
withstand
voltage
• Two point of contact, one positive pole and one
negative pole
• Low profile and impact footprint on PCB
• 6AWG to 8AWG crimp contact with insulated
latching housings
• RADSOK® Socket and Pin: Silver over nickel
plating
• Crimp Barrel and Receptacle Body: Tin over
nickel plating
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Amphenol Industrial IoT
Solution Site
Amphenol Industrial RADSOK®
Power to Board Connectors
" The market for industrial
interconnect technology globally
is expanding as the world
becomes more modernized."
