Issue link: https://resources.mouser.com/i/1437744
Another issue for silicon devices is the reduction in di-electric breakdown strength due to high temperatures. A reduction in di-electric breakdown strength can cause breakdown events where current flows through the insulator and can weaken or destroy the insulating capacity. Breakdown strength can be increased by providing more room for di-electric insulators. This increases the device size, but when done strategically (only near high-current devices, for example) can provide a significant improvement. Another high temperature effect, metal migration, can also be mitigated by using less aggressive processing lithography—in this case using wider metal lines. If metal lines become too narrow, the current flow becomes so high that metal atoms can be "pushed" along by the current flow causing voids and discontinuities in signal lines. This can increase resistance and impact signal integrity which leads to device failures. One of the common ways to avoid failure and extend operating lifetimes of important devices, such as sensors, is to employ redundancy in the design. Multiple sensors can be used to make the same measurements and if the results widely differ, it can be assumed a sensor failure has occurred. Predictive maintenance algorithms can be used to provide indications of wear and tear and predict possible failures by interpreting data fluctuations between individual sensors. pACkAging deviCeS FoR Automotive implementAtionS The most visible aspect of component design is device packaging. Industry standard plastic packages have been supplanted by hermetic ceramic packages for temperatures above 175°C, the point at which package-related substances have their glass transition temperature. Operating above this temperature can cause increased thermal strain which can lead to failures, delamination and cracking for example. Hermetic ceramic packages are preferred for high-temperature applications, but these packages do tend to be more expensive than the plastic versions. The hermetic seal is strong enough to protect the device from moisture and contamination that can cause corrosion, another benefit of this packaging type. Hermetic packages are often larger and heavier than plastic packages, so they may be more vulnerable to vibration and mechanical shock. It is important to consider not only temperature but other factors like contamination, vibration and cost when comparing packaging alternatives. Package lead type and metallization can also impact a device's performance in a harsh environment. Surface-mount components are bonded directly to the printed circuit board, so the strength of the attachment depends on The most visible aspect of component design is device packaging. Industry standard plastic packages have been supplanted by hermetic ceramic packages for temperatures above 175°C, the point at which package- related substances have their glass transition temperature. 22