ConCluSion
We anticipate the amount of electronics used in
harsh automotive environments to continue to
grow not only as advanced safety and reliability
features continue to be added, but as the vehicle
itself migrates to electric operation and away
from fossil fuels. Innovative solutions will continue
to develop, perhaps finding ways to minimize
heat generation and to use heat and vibration as
energy sources for key electronic components.
The future of the automotive industry may lie
in the quality and functionality of the electronic
devices under the hood.
the size of the bond pad area and the adhesive
quality. Small bond area and poor adhesive quality
can make the package vulnerable to vibration and
shock. In a through hole dual-in-line package (DIP)
configuration, pins that provide high shock and
vibration resistance are inserted into and soldered
to the board.
Current leakage effects discussed previously in
relation to on-chip signals can also occur at the
device and board level. Parasitic effects between
signals increase due to high temperatures
and printed circuit board flux residue can be
minimized by proper signal layout, while device pin
placement can keep important signals sufficiently
separated to minimize parasitic leakage current.
We anticipate the amount of electronics used in harsh
automotive environments to continue to grow
not only as advanced safety and reliability features
continue to be added, but as the vehicle itself migrates to
electric operation and away from fossil fuels.
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