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Kemet - 7 Experts on New Approaches for Power Distribution Network Design

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20 20 KEY POINTS 1. Chip designs have become denser, but their chip-package resonant frequencies have not changed much because as silicon capacitance went up in denser packages, technology evolved to reduce inductance. In power-converter switch devices, to make the conversion more efficient, you must reduce capacitance and inductance simultaneously. 2. When working to shrink a design with high-current circuit loops of a certain size and distance, if distances shrink faster than loop shrinkage, you will increase the coupling coefficient, which can cause unexpected problems. ISTVAN NOVAK Principal Signal and Power Integrity Engineer, Samtec Flex Suppressor® T52x & T530 KO-CAP® Polymer Capacitors Electromagnetic wave suppression—the electromagnetic wave enters through the sheet and is suppressed by losing its magnetic structure Resonance suppression—controls the high- frequency current and suppresses unwanted electromagnetic resonance by creating impedance Wide range of frequencies available from MHz band to GHz band Combines the low ESR of MLCCs, the high capacitance of aluminum electrolytic, and the volumetric efficency of tantalum into a single surface mount package Unlike liquid electrolyte-based capacitors, KO-CAP has a very long operation life and high ripple current capabilities KO-CAP features stable capacitance across temperature and voltage

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