Mouser - White Papers

Mouser Electronics White Paper Although SMT is already the standard in PCB design and manufacturing, market research still anticipates significant growth for surface-mount technology and components in the near future. The SMT market projects a compound annual growth rate of 10.8 percent over the next seven years and could exceed US$90 billion by 2030. The Evolution of Surface-Mount Technology Newer surface-mount technologies and packaging solutions enter the market as emerging solutions and eventually displace older, mature technologies that become obsolete (Figure 3). Figure 3: The evolutionary life cycle of surface mount technology. (Source: Vishay) Innovations in SMT packaging often involve advancements in packaging materials, bonding methods, and die-supporting substrates. These improvements are sometimes complemented by advances in manufacturing techniques, such as automated optical inspection (AOI) and enhanced thermal transfer methods, as well as automated placement and soldering processes. Below are a few notable SMT packaging innovations: • Surface-mount connections: Transitioning from gull- wing pins to under-chip surface-mount tabs has allowed for dramatic space reductions on the board. • Inspection and Reliability: Packaging with surface mount tabs eliminates the need for AOI or X-ray verification of solder efficacy, helping to lower manufacturing costs and improve reliability. • Heat Transfer: Expanding tabs beneath SMD components has improved heat transfer out of the die onto the PCB, thereby increasing reliability and enhancing the device's power efficiency These SMT packaging innovations have paved the way for a number of components that offer significant enhancements over previous products eSMP Vishay's eSMP packages are a more compact and efficient solution than previous iterations of SMT for PCB design and manufacturing due to their reduced form factor and reliability (Figure 4). The expanded cathode pad design enables maximized power ratings while still downsizing the overall form factor and saving valuable board space. Devices in the eSMP series include TMBS ® ; Schottky rectifiers; FRED Pt ® rectifiers; ultrafast recovery, avalanche, standard- and fast-recovery rectifiers; PAR ® TVS; TransZorb ® TVS; ESD protection diodes; and Zener diodes. eSMP devices are an optimal solution for lighting and telecommunications applications, industrial or automotive applications requiring The low profile of Figure 4: Vishay's eSMP packaging solutions. (Source: Vishay) the eSMP series of packaging solutions is a significant upgrade for SMT. The MicroSMP, for example, is just 2.5mm × 1.3mm and only 0.65mm high, allowing for closer stacking of boards and more overall board space in multi-board designs. The MicroSMP also takes up 57 percent less board space than its predecessor, the SMA package. DFN Vishay's DFN packaging solutions also offer a reduced footprint while providing much lower thermal resistance (Figure 5) and overall package inductance. The DFN 1006 package is only 1mm × 0.6mm, providing more available board space with a reduced size profile, significantly lower thermal resistance, and reduced inductance due to shorted leads.

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