Mouser - White Papers

Mouser Electronics White Paper Figure 5: DFN packages deliver significantly lower thermal resistance than SOT packages. (Source: Vishay) These properties make DFN packages optimal for high-power density and mid-range switch frequency applications (Figure 6). Figure 6: DFN packaging solutions provide greater efficiency in a smaller form factor than their predecessors. (Source: Vishay) Without visible solder joints to inspect, DFN packages implement wettable flanks on the sides of the package to make the soldering connections. Specific DFN packages also boast an automated optical inspection (AOI) feature, a capability typically associated with standard packages with exposed leads. AOI allows for continual monitoring of the solder between the chip and PCB for strength and reliability, a key factor in meeting the strict safety requirements that some automotive and industrial applications demand. The Power DFN series of packages is highlighted by the DFN3820A, designed primarily for rectifiers and transient voltage suppressors. With a 3.8mm × 2.0mm footprint and a height of just 0.88mm, it's significantly smaller than an SMP package case while delivering up to double the performance of an SMP under equivalent thermal conditions. Rectifiers in a DFN3820A package have a maximum 7A rating, and DFN-packaged components are AEC-Q101 certified for automotive applications and have applications in industrial settings, computers, consumer electronics, and telecommunications. Like the Power DFN series, Vishay's Signal DFN packages also provide reliable performance in a smaller form factor than the competition. The DFN Ultra Compact model for small signal Zener and Schottky switching diodes takes up only 10 percent of the board space compared to conventional SOD/T packages and boasts soldering joints that can be examined visually instead of through X-ray or AOI inspection (Figure 7). Their leadless, compact packaging (1mm × 0.6mm × 0.45mm) delivers extreme reliability and better power dissipation than its predecessors while reducing noise and current leakage. Figure 7: DFN packaging solutions reduce chip height by up to 75% and nearly 50% in overall space. (Source: Vishay) FlatPAK 5x6 Vishay's FlatPAK 5 x 6 package offers a reduced form factor that distinguishes it from other package designs. This package saves board space by providing equivalent functionality in a single package that typically requires two SMC-size packages in more conventional designs (Figure 8). FlatPAK 5 x 6 packages use oxide planar technology to deliver more efficient performance in an even smaller package. Their significantly reduced footprint and wide operational temperature range also make them a good fit for industrial and automotive applications, including automated engine control, anti-locking braking systems, airbag deployment, and various telecom and automated safety systems applications. Figure 8: FlatPAK packaging solutions can bundle two SMCs into a single, slimmer package with a smaller footprint. (Source: Vishay)

• Cover