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29 | HTCC and LTCC technologies tend to survive very high temperatures, have a low coefficient of thermal expansion (CTE) compared to PCBs, and can be hermetically sealed as part of the fabrication process. Given the ruggedness and stability of HTCC and LTCC circuits, RF circuits made with this technology are often used for space and defense applications. IC Technology IC microelectronic technology is the foundation for many active devices and some passive RF components. There are several names for different classes of IC used in RF technology, including RFIC and microwave monolithic IC (MMIC). Many past RFIC and MMIC designs resulted in a chip with a single function—such as a power amplifier, low-noise amplifier, mixer, or switch—made with processes or semiconductor materials that exhibit better RF characteristics. RFICs are typically mounted on other RF circuit technologies to realize parts and systems. Unlike traditional RF ICs that focus on a single function, RF systems-on-chips (RFSoCs) and RF systems-in-packages (RFSiPs) integrate multiple RF components— such as amplifiers, mixers, and converters—into a single package, enabling highly compact and programmable RF systems. ICs are manufactured in semiconductor fabrication facilities that require substantial infrastructure and equipment. RF circuit design and implementation using this technology is highly complex, requiring intricate supply chains and specialized expertise. Hence, there are dedicated chip manufacturers and fabless design houses that partner with chip fabricators to produce RFICs that supply most of the commercially available RF chips. Some governments and private organizations own chip fabrication facilities and leverage these to be more competitive and to develop protected technologies. Specialized & Custom Processes There are several specialized and custom processes for manufacturing RF circuits, including laser-defined structuring (LDS) and micro-coaxial technology. LDS processes use a laser to catalyze metallic particles within a carrier material, allowing conductor deposition or plating. This technology is often used in very dense electronics housing for ADL8103-EVALZ Evaluation Board mouser.com/adi-adl8103-evalz-eval-board