Electronic Component Packaging: A Buyer Overview
The wide array of electronic components requires diverse packaging solutions that meet the protection, manufacturing, automation compatibility and cost-efficiency requirements of those components.
The 7 Types of Electronic Component Packaging
There are seven types of packaging used for electronic components.
1. Tape & Reel packaging places components in precisely spaced embossments along a carrier tape. It’s used in high-volume manufacturing environments where speed and efficiency are vital. Reels can be cut for prototyping.
2. Tube or “stick” packaging offers a secure, organized method for handling semiconductors and sensitive components. It offers excellent protection for delicate parts.
3. Tray packaging uses plastic or metal trays to precisely organize components, enabling the handling of larger or more delicate parts that require extra care.
4. Bulk packaging is a cost-effective method used for durable components that are less sensitive to damage during shipping and handling.
5. Waffle pack or “chip tray” features a grid-like structure that holds individual components in separate compartments, making it especially good for tiny, sensitive components.
6. Blister pack packaging is widely used for retail packaging and encloses components between a pre-formed plastic blister and a backing card.
7. Clamshell packaging is versatile, protects against physical and electrostatic damage, and is often used for high-value or sensitive components.
Each packaging type has a list of considerations for procurement including manufacturing process, product lifecycle, and more.
To learn more about these considerations read this blog on Mouser’s Purchasing Resource Library. Find the link in the description below.