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Samtec - Flyover ® Solutions Break Next-Gen System Architecture Constraints

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C h a p t e r 2 | U n d e r s t a n d i n g C o m m o n C h a l l e n g e s t o R o u t i n g H i g h - S p e e d S i g n a l s AcceleRate ® Slim Direct Attach Cable Assembly FireFly ™ Low-Profile Micro Flyover System ™ Learn More Learn More Key Points • When designing PCBs for high- speed applications (well exceeding the 10 Gbps barrier), engineers must take several design factors into account, including the angle at which PCB traces are routed, types of PCB dielectric used, via terminations, and more. • From reflections to emissions, even the slightest mistake in a high-speed PCB may lead to disastrous results; even if a PCB is designed optimally, high-speed signals will face other challenges, including signal integrity and routing length. 11 Samtec Flyover ® Solutions Break Next-Gen System Architecture Constraints

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