components generally scales with operating
frequency, devices operating at 56/112 Gbps PAM4
data rates are likely to be some of the industry's
most energy-intensive devices (by computing
standards). If these components are located close
to each other to maintain signal integrity, trying
to extract heat using conventional methods (e.g.,
heatsinks) may be problematic. Furthermore, having
components located too close to each other could
cause the heat from one component to transfer into
another. Therefore, Samtec Flyover systems allow
engineers to separate such components, offering
more space for alternative thermal management
solutions while also limiting the thermal effects on
neighboring components.
In addition to improved thermal management, the
ability to increase the distance between parts and
boards allows designs to spread out, which may
help with manufacturing. For example, in networking
applications, the switching application-specific
integrated circuit (ASIC) is typically placed near
the front panel to minimize trace lengths. However,
Flyover systems allow the switching ASIC to be
positioned closer to the backplane.
Larger PCBs that try to put everything
onto a single board can be broken down
into smaller modules that are then
connected via cable assemblies. This
helps to improve system reliability as
well as future-proof designs with the
ability to easily upgrade specific systems
components."
Andy Shrout
High-Speed Cable Product Manager, Samtec
C h a p t e r 3 | S o l v i n g H i g h - S p e e d S i g n a l I n t e g r i t y C h a l l e n g e s W i t h S a m t e c F l yo v e r S y s t e m s
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Samtec Flyover
®
Solutions Break Next-Gen System Architecture Constraints
