C h a p t e r 2 | T h e Tr a d e - O f f s i n Pe r f o r m a n c e , D e s i g n , a n d I n t e g r a t i o n
tested to deliver exact performance
under predefined conditions, outweighs
the modest cost premium. Engineers
ultimately save on time otherwise spent
sourcing, simulating, debugging, and
verifying individual components.
Finally, material selection, for both
active and passive elements, is another
axis along which performance must be
traded against manufacturability. For
example, to manage increasing current
density without excessive thermal rise,
interconnects must use low-resistance
materials and optimized contact
surfaces. This requirement often drives
the choice of plating, contact design,
or connector geometry. Similarly, die-
level architectures must balance analog
precision with the density and isolation
required to fit multiple channels into a
tightly constrained layout.
Ultimately, managing trade-offs
in miniaturized systems requires
coordination across design disciplines
and supply chains. Power, signal,
mechanical, and thermal subsystems
cannot be treated independently. Each
design iteration must consider how
choices in one domain will propagate to
the others.
Fortunately, integrated solutions offer
one path through this complexity. By
controlling more of the system and
validating it in advance, these building
blocks reduce the number of unknowns
and enable engineers to design smaller
systems with greater confidence.
While miniaturization is essential,
the importance of cost depends
on the application. In single-use
devices, cost constraints often
take priority, whereas in long-term
implants, performance typically
outweighs cost considerations."
Diego Sorrentino
Electrical Engineering Functional Manager, StarFish Medical
15
11 Experts on Miniaturized Electronics Design and Applications
