Infineon's Top-Side Cooled (TSC)
Q-DPAK Package
Chapter 3
The power electronics industry has long faced
a fundamental dilemma: choosing between
through-hole packages for better thermal
performance or surface-mount packages for
easier automated assembly. Infineon's topside
cool Q-DPAK package addresses this by
providing both benefits in one solution.
The Evolution from Compromise
to Integration
Traditional through-hole packages dominate high-power
applications because they mount directly to heatsinks,
offering effective thermal performance. However,
this benefit comes with a cost—manual insertion and
soldering processes that raise manufacturing expenses
and limit scalability.
Surface-mount packages have improved manufacturing
efficiency through automated assembly, especially for
bottom-side cool variants. However, these packages have
a weakness: heat must escape through the PCB, creating
a thermal bottleneck that limits power handling capacity.
The PCB itself becomes the limiting factor, preventing
these devices from reaching their full potential.
The topside cool Q-DPAK package solves this issue. By
allowing direct heatsink mounting, similar to a through-
hole package, while maintaining surface-mount assembly
compatibility, it provides excellent thermal performance
without sacrificing manufacturing efficiency.
13
Enabling Compact, Efficient Designs with High Voltage CoolSiC™ Discretes
