Issue link: https://resources.mouser.com/i/1537950
C h a p t e r 4 | I n f i n e o n T o o l s a n d R e s o u r c e s f o r D e v i c e S i m u l a t i o n a n d D e s i g n Your Complete Design Journey To help you start using these tools and turn simulations into successful designs, Infineon offers additional resources: For understanding the technology: Application pages and product web pages featuring: • Application notes on Gen 2 technology • Heat sink assembly guidelines for the Q-DPAK • Short videos explaining some technical features of the product For detailed Implementation: • Complete reference design documentation • Thermal assembly guidelines • Circuit optimization techniques These resources connect the simulation environment to real-world applications, supporting your journey from concept to production at every step. For more detailed information, please visit the resources available on Infineon's website. A New Era in Power System Design The power electronics industry is at a critical turning point, and Infineon's CoolSiC™ technology portfolio offers the comprehensive solutions engineers need to face future challenges now. From the robust trench- based architecture and Generation 2 performance improvements to innovative packaging options like the TO-247-4HC and topside-cooled Q-DPAK, this technology platform eliminates traditional design trade- offs while delivering significant improvements in efficiency, thermal management, and power density. When combined with advanced simulation tools and validated reference designs, CoolSiC™ technology not only enables better power systems but also fundamentally expands the possibilities in power electronics design, empowering engineers to create compact, high-efficiency solutions that shape the future of industrial applications. 21 Enabling Compact, Efficient Designs with High Voltage CoolSiC™ Discretes