Issue link: https://resources.mouser.com/i/1537950
C h a p t e r 3 | I n f i n e o n ' s T o p - S i d e C o o l e d ( T S C ) Q - D P A K P a c k a g e This improvement results from eliminating the parasitic inductances found in TO-247 packages. Although TO packages limit switching speed because of their physical design, Q-DPAK packages eliminate these restrictions, allowing silicon carbide technology to fully realize its performance advantages. Building a Comprehensive Platform The benefits extend beyond individual devices through Infineon's x-DPAK platform. By standardizing on consistent package heights, designers can integrate different technologies—CoolMOS, IGBTs, CoolGaN, and CoolSiC™—on a single PCB under one heatsink. This flexibility enables optimization of each circuit function without mechanical limitations. The platform scales from compact, low-power devices to large-die, high-current IGBTs, all within the same mechanical framework. Circuit designers can select the best technology for each function while maintaining assembly compatibility. JEDEC registration promotes industry-wide standardization, supporting second-source options and encouraging widespread adoption. Available configurations include Q-DPAK dual variants for half- bridge topologies (with matched switches), boost topologies (switch plus diode), bridge rectifiers (dual CoolSiCTM diode), and Q-DPAK mono versions for single-switch applications. Addressing the Assembly Challenge The direct heatsink mounting that improves thermal performance also presents assembly challenges that must be carefully managed. Unlike bottom-side cool packages, which rely on PCB mounting, topside cool packages require precise control of the thermal interface between the device and heatsink. Package height tolerances, though tightly controlled, still need to be accommodated with thermal interface materials. When multiple devices are mounted under a single heatsink, ensuring uniform contact across all devices becomes essential for balanced thermal performance and reliability. 16 Enabling Compact, Efficient Designs with High Voltage CoolSiC™ Discretes