Issue link: https://resources.mouser.com/i/1538715
Importantly, steeper switching edges expand the EMI spectrum, increasing both the frequency and intensity of electrical noise. As a result, passive components must be selected carefully to manage this noise without introducing loss, instability, or thermal stress. Magnetics, in particular, require materials with wider effective frequency ranges and core structures that can suppress both differential and common-mode noise. Materials like nanocrystalline alloys and metal-composite inductors are increasingly used for their ability to operate efficiently across wide switching bands without saturating or overheating. Capacitor selection is equally impacted. Conventional aluminum electrolytics often fall short in these conditions due to their limited frequency response and high ESR. Engineers now turn to low-ESR polymer capacitors, hybrid aluminum–polymer capacitors, and high-frequency MLCCs, especially those using Class I dielectrics like C0G or U2J. These technologies offer the thermal resilience and frequency stability needed for WBG-based converters and inverters in automotive environments where derating margins are tight and forced cooling is not always available. Increased power density adds a second layer of constraint. The goal of WBG devices is both better performance and smaller form factors, and the latter leads to tighter component spacing and shorter thermal paths. Passive components must therefore be low profile and capable of dissipating heat without external airflow. Inductors, often the largest contributors to self-heating, must be thermally coupled to chassis structures or heat sinks to prevent hot spots from degrading system reliability. Layout considerations also become top priority in these dense designs. Stray inductance, parasitic capacitance, and thermal crosstalk erode the theoretical advantages of WBG hardware. C h a p t e r 2 | W i d e B a n d g a p a t W o r k— S i C a n d G a N D r i v e t h e Fu t u r e Lingan Jeevanandam Specialist Hardware Engineer, Volvo Group GaN and SiC technologies enable higher switching frequencies and voltage levels, which significantly increase dv/dt stress on passive components. This drives the need for tighter PCB layouts, improved EMI performance, and high-grade capacitors and magnetics with superior thermal and voltage tolerance." 13 Powering the New Automotive Era with Smart Passive Solutions