Issue link: https://resources.mouser.com/i/1538715
C h a p t e r 2 | W i d e B a n d g a p a t W o r k— S i C a n d G a N D r i v e t h e Fu t u r e Passive components with low ESL and consistent temperature behavior are needed to maintain the performance envelope defined by the active devices. In many cases, ceramic capacitors are replacing film in resonant circuits due to their superior high-frequency behavior and lower dissipation factor. Lastly, the push for higher integration, such as combining onboard chargers with DC-DC converters or placing gate drivers near traction inverters, further raises expectations for passives. Functional safety, EMI control, and thermal reliability must all be addressed simultaneously. Given these constraints, design teams are increasingly relying on accurate modeling and simulation tools to evaluate performance up front. Advanced simulation platforms can account for ripple behavior, dynamic current profiles, saturation thresholds, and thermal interactions to provide a better understanding of component behavior before hardware fabrication. YAGEO offers solutions that ease the adoption of WBG semiconductors, such as • High-frequency MLCCs with Class I dielectrics like C0G and U2J; • Low-ESR polymer and hybrid capacitors designed to handle high ripple current; • Metal-composite inductors with soft saturation and low DC resistance; and • Broadband common-mode chokes and precision resistors for EMI suppression and gate drive stability in GaN- and SiC- based systems. Higher dV/dt results in a broader high-frequency noise spectrum. For inductors, this means the core material must be effective at handling higher frequencies." Michael Freitag Sr. Director, Global Product Management, YAGEO Group Electronics Corporation 14 Powering the New Automotive Era with Smart Passive Solutions