C h a p t e r 2 | E l e c t r i c a l a n d T h e r m a l P e r f o r m a n c e o f 1 2 0 0 V C o o l S i C ™ M O S F E T G 2 i n T O - 2 4 7 - 4 H C P a c k a g e
These thermal improvements, combined with the
switching loss reduction, provide three main benefits:
• 11% higher output current capacity compared to
Generation 1
• 10°C cooler operation when directly replacing
Generation 1 in existing systems
• Up to 50% higher switching frequency, allowing for
more compact designs
Portfolio Range and Flexibility
Generation 2's expanded portfolio addresses diverse
application needs with RDS(on) values:
• TO247: 7 to 78 milliohms (lowest available on the
market)
• Q-DPAK: Down to 4 milliohms
• D²PAK: Down to 8 milliohms
This range, combined with the guaranteed maximum
RDS(on) at high temperatures specified in the
datasheet, simplifies system design by providing
appropriate safety margins.
Revolutionary Package Design:
Engineering for Real-World Applications
The TO247 4-pin high creepage package maintains
compatibility with existing standards while adding new
features. It remains pin-to-pin compatible with standard
TO247 4-pin packages from any manufacturer, allowing
for easy replacement without board modifications.
However, several innovations within this familiar
footprint improve reliability and simplify use.
The Trouser Design:
Extending Creepage Distances
A unique "trouser design" extends the mold body
along the leads, creating steps on both the front and
back sides. Paired with strategic grooves, this design
results in:
Pin-to-pin creepage distance: 9mm
Lead-to-heatsink creepage: 5mm
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Enabling Compact, Efficient Designs with High Voltage CoolSiC™ Discretes
