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TE Connectivity Chipconnect Internal Faceplate-to-Processor Cable Assemblies - New Product Brief | Mouser Electronics

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TE Connectivity's Chipconnect Internal Faceplate-to-Processor Cable Assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. Learn More: http://mou.sr/TEChipconnect