Building Modular Data Centers for AI Workloads

Why Internal Interconnects Matter Beyond Servers

(Source: WILL PHOTOGRAPHY/stock.adobe.com; generated with AI)

The growth of artificial intelligence (AI) is pushing data center operators to rethink how they deploy computing infrastructure. Adding more servers is no longer enough to scale AI workloads efficiently. Processor densities and power consumption are increasing, while data volumes continue to grow. These factors are driving changes throughout the data center, from rack design to internal system architecture.

Most attention focuses on the processors themselves, but less obvious are the changes needed to support them. The move toward modular architectures is one of those changes. Rather than building highly customized installations, operators are deploying standardized building blocks that can be assembled and serviced more efficiently. Modularity simplifies installation while allowing capacity to expand as demand grows.

Making modular architectures practical also depends on what happens inside each module. Every subsystem depends on reliable internal interconnects that provide compact, reliable signal and power connections between the electronic assemblies that make up each module. As data center designs continue to evolve, internal connections become as important as the high-speed networking links that connect servers.

This blog explores how AI is reshaping data center design and driving the adoption of modular architectures built from standardized components. It also highlights how dependable internal interconnects are critical to achieving efficient scaling, serviceability, and long-term performance.

How AI Is Reshaping Data Center Architectures

Traditional enterprise data centers were primarily designed around north-south traffic, where information flows between users and servers. AI workloads introduce a different challenge: servers continuously exchange data across clusters of graphics processing units (GPUs) and high-performance accelerators. Training large language models (LLMs), AI inference, and other accelerated computing workloads generate enormous volumes of east-west traffic, increasing the need for tightly integrated compute, power, and monitoring systems within each rack.

Supporting these workloads demands significant increases in processing density. Modern AI racks may consume more than 100kW, with some next-generation installations expected to exceed 200kW.^[1] As rack densities increase, power delivery, cooling and system integration become more difficult. The growing concentration of electronic assemblies also increases the number of internal connections required to distribute power, exchange signals and support system monitoring within modular server platforms.

Data center operators often need to add capacity faster than traditional construction cycles allow. Instead of designing each deployment from the ground up, many are turning to modular architectures built on proven server, power, and infrastructure components. Industry efforts such as the Open Compute Project (OCP) and Open19 help provide common frameworks that can be scaled as demand grows.^[2]

A modular approach breaks a data center into groups of repeatable assemblies. Server trays, power modules, and monitoring systems can be built, tested, and validated before installation, enabling faster expansion and reduced variation across deployments. These modular building blocks rely on compact, dependable internal interconnects that simplify assembly while supporting serviceability and future upgrades.

Most of the attention goes to the networking links between racks. Inside each rack, however, are dozens of smaller connections that link server trays, power systems, monitoring hardware, and control electronics. Those internal connections are usually not visible but can affect how equipment is built, maintained, and upgraded throughout its service life.

Why Modular Infrastructure Depends on Internal Interconnects

Faster deployment is one part of the appeal of modularity. Modular designs also make maintenance easier. When a problem occurs, technicians often replace an entire server tray or power module rather than troubleshooting individual components within a rack. This efficient approach lets equipment return to service much more quickly.

In some architectures, modules can also be designed for hot-swap replacement, allowing failed components to be exchanged without shutting down the entire system. This minimizes disruption to running workloads and reduces the time technicians will spend servicing the equipment in the field. As rack power levels and equipment densities continue to increase, reducing maintenance complexity becomes more important.

That, in turn, places greater emphasis on the electronic assemblies within each module. Server trays, power subsystems, monitoring electronics, displays, and control boards all require compact internal connections that can be assembled quickly while maintaining reliable operation through repeated servicing and upgrades.

Unlike the optical links and high-speed copper cabling that connect servers and switches, these interconnects operate entirely within the module. Within a module, they connect circuit boards, sensors, displays, and other electronics, often in tight spaces where larger cable assemblies would be difficult to route.

Enabling Internal Connectivity with FFC and FPC Jumpers

Flexible flat cable (FFC) and flexible printed circuit (FPC) jumper assemblies are well-suited for many compact internal connections because they occupy very little space while allowing signals to be routed cleanly between adjacent boards. Their flexibility makes it easier to route cables through tightly packed electronic assemblies, simplifying assembly and helping maintain consistent installations.

One example is Molex Premo-Flex FFC/FPC jumper assemblies, developed for compact board-to-board interconnections where space, routing flexibility, and reliability are crucial design considerations. The diverse portfolio includes a broad variety of jumper assemblies that allow engineers to select the combination of mechanical performance, flexibility, and packaging that is best suited to each application.

For modules that may require regular servicing, Premo-Flex superior retention FFC/FPC Jumpers provide secure cable retention to help maintain reliable connections during installation and maintenance. Their high-temperature capability and flame-retardant construction also make them suitable for demanding electronic environments.

high-speed FFC/FPC jumpers provide a compact way to connect multiple circuit boards while supporting high data rates. Their small footprint helps conserve space inside densely packed server hardware. Monitoring systems depend on sensors, displays, and in some cases, cameras, to help operators track equipment health, environmental conditions, and physical security. Server modules often contain multiple circuit boards that need to exchange data quickly. For these applications, Low-Voltage Differential Signaling (LVDS) jumper assemblies provide high-fidelity signal transmission over longer cable lengths while maintaining the compact form factor needed inside modular equipment.

Where packaging density becomes a primary concern, SlimStack FFC/FPC jumpers use low-profile Molex SlimStack Connectors to reduce the overall height of the interconnect. Designers can take advantage of compact connections to make more efficient use of the space inside server trays and control modules.

Jumper assemblies are supported by compatible connector systems, including FFC/FPC Connectors and SlimStack Connectors, providing a complete interconnect solution for use within modular assemblies. Together, they simplify integration while supporting the repeatable manufacturing processes on which modular architectures depend.

Conclusion

Building a modern AI data center often means adding large amounts of compute in a short period. Modular architectures help meet that demand by allowing server, power, and monitoring systems to be deployed as repeatable building blocks.

However, successful modularity depends on more than rack layouts and server designs. Every module relies on compact, robust internal interconnects that allow complex electronic assemblies to operate reliably while remaining straightforward to manufacture, maintain, and upgrade. Flexible interconnect solutions, such as the Molex Premo-Flex solution, provide the dependable board-to-board connectivity needed to support the next generation of modular AI data centers.

Sources

[1]https://www.se.com/in/en/download/document/SPD_WP126_EN/
[2]https://www.opencompute.org/, https://greensoftware.foundation/standards/open19/

Author

David Pike is well known across the interconnect industry for his passion and general geekiness. His online name is Connector Geek.